FASTPCBA


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FASTPCBA 20 years' experience for PCB Assembly.

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2408
What is difference between PCB and PCBA?

What is difference between PCB and PCBA?

we know that PCBA generally refers to a process flow, and also it is a piece of finished circuit board. After all the processes on the PCB are completed, we call it PCBA. The PCB r...

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0512

Soldering iron tips correct selection and ma...

The correct choice of the flame iron head can achieve better welding at the lowest temperature, and maximize the se...

0412

AOl basic principles and application advice

AOl is the same as human judgment. The basic principle of AOI inspection is to use artificial light source LED ligh...

0412

PCB manufacturing reflow soldering furnace t...

The main technical indicators of PCB manufacturing reflow furnace are temperature control accuracy, lateral tempera...

0312

Prototype pcb panel design requirements

In order to make full use of the substrate and improve the placement efficiency, multiple small printed boards with...

0312

In PCB manufacturing,component layout direct...

In order to make both ends of the PCB manufacturing components contact the solder wave at the same time, the long a...

0212

Wave soldering flux coating, welding tempera...

There are many process parameters of wave soldering, mainly including flux coating amount, printed board preheating...

2911

Main parameters affecting solder paste chara...

Main parameters affecting solder paste characteristics The main parameters that affect the characteristics of sold...

2811

Solder Paste Collapse Cause Analysis

Collapse is divided into cold collapse and hot collapse. Cold collapse refers to the collapse behavior that occurs ...

2711

Im-Sn plating

Im-Sn is the abbreviation of Immersion Tin, commonly known as immersion tin and melting tin.

2611

QFN packaging and process features

QFN packaging and process features QFN is the most widely used BTC. At first it was only used for products with lo...

2511

PCB manufacturing solder paste storage and a...

Solder paste is the most important process material, and It’s a very important process operation for solder paste’...

2111

Cleaning agent in PCB manufacturing

The cleaning agent is mainly used for post-weld cleaning of assembled boards, to remove flux residues after reflow,...

1911

In PCB manufacturing, wave soldering machine...

It is widely used in PCB manufacturing wave soldering and mixing process, especially in electronic products.

1911

Surface mount printed circuit SMT requireme...

The Surface Mount Prined Circuit Board (SMB) is very different from the traditional printed circuit board. The SMT ...

1811

SMC/SMID components (SsD) transportation, st...

Unsuitable storage conditions can cause component quality to deteriorate, resulting in poor solderability. The stor...

1611

Printed Circuit Boards Thermal Design Introd...

Electronic devices will get hot during work. The failure rate of electronic products increases exponentially with i...

1611

Surface assembly process design principles

Typical surface assembly methods include full surface assembly, single-sided mixing, and double-sided mixing. Full ...

1511

Solder paste printing principle

Solder paste printing is the first step in the SMT assembly process, and its function is to distribute solder paste...

1411

Wave soldering process parameter setting req...

Frequently debugging wave soldering process parameters include component surface preheating temperature, soldering ...

1311

Flux behavior in wave soldering

During wave soldering, the flux will partially evaporate during the preheating phase, cleaning the surface to be so...

FASTPCBA Electronics Co.,Ltd

  • 3/F. 1/B, 18-2 Yuquan East Rd. Yulv Village.
    Guangming New district. Shenzhen. China.
  • F:86-18320744730
  • pcba23@pcb-smt.net
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