we know that PCBA generally refers to a process flow, and also it is a piece of finished circuit board. After all the processes on the PCB are completed, we call it PCBA. The PCB r...
Learn More +The correct choice of the flame iron head can achieve better welding at the lowest temperature, and maximize the se...
AOl is the same as human judgment. The basic principle of AOI inspection is to use artificial light source LED ligh...
The main technical indicators of PCB manufacturing reflow furnace are temperature control accuracy, lateral tempera...
In order to make full use of the substrate and improve the placement efficiency, multiple small printed boards with...
In order to make both ends of the PCB manufacturing components contact the solder wave at the same time, the long a...
There are many process parameters of wave soldering, mainly including flux coating amount, printed board preheating...
Main parameters affecting solder paste characteristics The main parameters that affect the characteristics of sold...
Collapse is divided into cold collapse and hot collapse. Cold collapse refers to the collapse behavior that occurs ...
Im-Sn is the abbreviation of Immersion Tin, commonly known as immersion tin and melting tin.
QFN packaging and process features QFN is the most widely used BTC. At first it was only used for products with lo...
Solder paste is the most important process material, and It’s a very important process operation for solder paste’...
The cleaning agent is mainly used for post-weld cleaning of assembled boards, to remove flux residues after reflow,...
It is widely used in PCB manufacturing wave soldering and mixing process, especially in electronic products.
The Surface Mount Prined Circuit Board (SMB) is very different from the traditional printed circuit board. The SMT ...
Unsuitable storage conditions can cause component quality to deteriorate, resulting in poor solderability. The stor...
Electronic devices will get hot during work. The failure rate of electronic products increases exponentially with i...
Typical surface assembly methods include full surface assembly, single-sided mixing, and double-sided mixing. Full ...
Solder paste printing is the first step in the SMT assembly process, and its function is to distribute solder paste...
Frequently debugging wave soldering process parameters include component surface preheating temperature, soldering ...
During wave soldering, the flux will partially evaporate during the preheating phase, cleaning the surface to be so...
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