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DIP assembly and process flow

date:2020-12-30 10:42:26

DIP Assembly

The dual in-line package is also called DIP assembly, or DIP for short. It is an integrated circuit assembly method. The shape of the integrated circuit is rectangular, and there are two parallel rows of metal pins on both sides, called pin headers. DIP assembled components can be soldered in the through holes plated on the printed circuit board or inserted into the DIP socket.

dip assembly

Cross-sectional view of dual in-line package chip

Because some new components only provide products assembled by surface mount technology, many companies produce adapters that convert SMT components into DIP assembly. ICs assembled by surface mount technology can be placed in the adapter, like DIP Assemble the same components and then connect them to the breadboard or other circuit prototype boards with in-line components.

The assembly of the dual in-line assembly chip is generally made of plastic or ceramic. Ceramic assembly has good airtightness, and is often used in equipment that requires high reliability. However, most of the dual-in-line assembly chips use thermosetting resin plastic. A curing cycle of less than 2 minutes can produce hundreds of chips.

DIP plug-in process flow

The DIP plug-in processing process is part of the entire PCBA processing process. It refers to the manual plug-in processing of large electronic components that cannot be processed by the chip. After the process flow such as wave soldering processing, the final PCBA processing product is formed. The process of DIP plug-in processing is relatively difficult and requires professional technical instructors for processing guidance. Its process flow can be roughly divided into three steps: scheduling, wave soldering and quality inspection. Next, we will explain to you the processing steps of each process in detail.

1. Arrange process

The operator determines the location number and direction of the material according to the BOM list, and arranges to everyone on the DIP plug-in cable to assign components to each employee. At this time, the first sample confirmation is required, and the last employee performs the inspection. Perform one-to-one comparison and inspection with the BOM, and then submit the first piece to the quality department staff for verification.

2. Wave soldering

After completing the first piece confirmation, mass production is carried out, and then wave soldering is carried out to fix the electronic components on the PCB circuit board. Wave soldering is divided into lead-free and lead-free. According to customer requirements and the size of electronic components, it is determined whether to use lead soldering or lead-free soldering. When performing wave soldering, the speed of the wave soldering chain, the height of the spray tin and wave soldering, and the most important processing time should be adjusted and controlled, generally 2 to 3 seconds. At the same time, hand welding is performed for some electronic components that are more thermally sensitive. Of course, it is necessary to trim the welded material.

3. Quality Inspection by Quality Department

Quality inspection is an important process to ensure the quality of PCB boards. We should inspect the solder joints for tin pull, false soldering, floating height, etc., and perform fine inspections according to the international standard IPC6101, assisting customer requirements, and ensuring delivery of customer satisfaction product.

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